Editor In Chief

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Chee Kai Chua   Mail
Head of Pillar, Engineering Product Development (EPD) Cheng Tsang Man Chair Professor Singapore University of Technology and Design
Singapore

Associate Editors

Wai Yee Yeong   Mail
Nanyang Technological University
Singapore
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Jiankang He   Mail
Xi'an Jiaotong University
China

Assistant Editor

Jia An   Mail
Nanyang Technological University
Singapore

Editorial Board Members

Prof Maling Gou   Mail
Sichuan University
China
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Prof. Mario Moisés Alvarez   Mail
Centro de Biotecnología-FEMSA
Mexico
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Aleksandr Ovsianikov   Mail
Vienna University of Technology
Austria
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Ali Khademhosseini   Mail
University of California - Los Angeles
United States
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Boris N. Chichkov   Mail
Leibniz University of Hanover
Germany
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Charlotte Hauser   Mail
King Abdullah University of Science & Technology
Saudi Arabia
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Cijun Shuai   Mail
Central South University
China
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Frederik Claeyssens   Mail
University of Sheffield
United Kingdom
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Geun Hyung Kim   Mail
Sungkyunkwan University, South Korea
Korea, Republic of
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Ibrahim Tarik Ozbolat   Mail
Penn State University
United States
Jin-Hyung Shim   Mail
Korea Polytechnic University
Korea, Republic of
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Lay Poh Tan   Mail
Nanyang Technological University
Singapore
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Makoto Nakamura   Mail
University of Toyama
Japan
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Martin Birchall   Mail
University College London
United Kingdom
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Michael Raghunath   Mail
Zurich University of Applied Sciences
Switzerland
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Paulo Jorge Da Silva Bartolo   Mail
University of Manchester
United Kingdom
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Prof Richard James Bibb   Mail
Loughborough University
United Kingdom
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Roger Narayan   Mail
North Carolina State University
United States
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Dr Sanjairaj Vijayavenkataraman   Mail
Assistant Professor of Mechanical Engineering Experimental Research Building (ERB), C1-039 New York University Abu Dhabi P.O. Box 129188, Abu Dhabi,
United Arab Emirates
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Prof Savas Tasoglu   Mail
University of Connecticut
United States
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Shoufeng Yang   Mail
Katholieke Universiteit Leuven (KU Leuven)
Belgium
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Vladimir Mironov   Mail
3D Bioprinting Solutions
Russian Federation
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Xiaohong Wang   Mail
Tsinghua University
China
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Yi Zhang   Mail
Nanyang Technological University
Singapore