Editor In Chief

Profile Image
Chee Kai Chua   Mail
Head of Pillar, Engineering Product Development (EPD) Cheng Tsang Man Chair Professor Singapore University of Technology and Design
Singapore

Associate Editors

Wai Yee Yeong   Mail
Nanyang Technological University
Singapore
Profile Image
Jiankang He   Mail
Xi'an Jiaotong University
China

Assistant Editor

Jia An   Mail
Nanyang Technological University
Singapore

Editorial Board Members

Prof Maling Gou   Mail
Sichuan University
China
Profile Image
Prof. Mario Moisés Alvarez   Mail
Centro de Biotecnología-FEMSA
Mexico
Profile Image
Aleksandr Ovsianikov   Mail
Vienna University of Technology
Austria
Profile Image
Ali Khademhosseini   Mail
University of California - Los Angeles
United States
Profile Image
Boris N. Chichkov   Mail
Leibniz University of Hanover
Germany
Profile Image
Charlotte Hauser   Mail
King Abdullah University of Science & Technology
Saudi Arabia
Profile Image
Cijun Shuai   Mail
Central South University
China
Profile Image
Frederik Claeyssens   Mail
University of Sheffield
United Kingdom
Profile Image
Geun Hyung Kim   Mail
Sungkyunkwan University, South Korea
Korea, Republic of
Profile Image
Ibrahim Tarik Ozbolat   Mail
Penn State University
United States
Jin-Hyung Shim   Mail
Korea Polytechnic University
Korea, Republic of
Profile Image
Lay Poh Tan   Mail
Nanyang Technological University
Singapore
Profile Image
Makoto Nakamura   Mail
University of Toyama
Japan
Profile Image
Martin Birchall   Mail
University College London
United Kingdom
Profile Image
Michael Raghunath   Mail
Zurich University of Applied Sciences
Switzerland
Profile Image
Paulo Jorge Da Silva Bartolo   Mail
University of Manchester
United Kingdom
Profile Image
Prof Richard James Bibb   Mail
Loughborough University
United Kingdom
Profile Image
Roger Narayan   Mail
North Carolina State University
United States
Profile Image
Prof Savas Tasoglu   Mail
University of Connecticut
United States
Profile Image
Shoufeng Yang   Mail
Katholieke Universiteit Leuven (KU Leuven)
Belgium
Profile Image
Vladimir Mironov   Mail
3D Bioprinting Solutions
Russian Federation
Profile Image
Xiaohong Wang   Mail
Tsinghua University
China