Editor In Chief

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Chee Kai Chua   Mail
Head of Pillar, Engineering Product Development (EPD) Cheng Tsang Man Chair Professor Singapore University of Technology and Design
Singapore

Associate Editors

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Wai Yee Yeong   Mail
Nanyang Technological University
Singapore
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Jiankang He   Mail
Xi'an Jiaotong University
China
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Liliang Ouyang   Mail
Tsinghua University
China

Assistant Editor

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Jia An   Mail
Nanyang Technological University
Singapore

Editorial Board Members

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Shweta Agarwala   Mail
Department of Electrical and Computer Engineering, Aarhus University, Aarhus
Denmark
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Mario Moisés Alvarez   Mail
Centro de Biotecnología-FEMSA
Mexico
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Richard James Bibb   Mail
Loughborough University
United Kingdom
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Martin Birchall   Mail
University College London
United Kingdom
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Christian Celia   Mail
Department of Pharmacy, University of Chieti 
Italy
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Boris Chichkov   Mail
Leibniz University Hannover
Germany
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Gianluca Ciardelli   Mail
Politecnico di Torino
Italy
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Frederik Claeyssens   Mail
University of Sheffield
United Kingdom
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Rui Domingues   Mail
3Bs Research Group, University of Minho
Portugal
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Eleonora Ferraris   Mail
Department of Mechanical Engineering, KU Leuven
Belgium
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Maling Gou   Mail
Sichuan University
China
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Charlotte Hauser   Mail
King Abdullah University of Science & Technology
Saudi Arabia
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Mei He   Mail
University of Kansas
United States
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Jingchao Jiang   Mail
School of Mechanical Engineering, Tongji University
China
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Qing Jiang   Mail
Drum Tower Hospital affiliated to Medical School of Nanjing University, Nanjing University
China
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Ali Khademhosseini   Mail
Terasaki Institute, Japan
Japan
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Geun Hyung Kim   Mail
Sungkyunkwan University, South Korea
Korea, Republic of
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Dimitrios A. Lamprou   Mail
Queen's University Belfast
United Kingdom
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Vladimir Mironov   Mail
3D Bioprinting Solutions
Russian Federation
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Makoto Nakamura   Mail
University of Toyama
Japan
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Roger Narayan   Mail
University of North Carolina and North Carolina State University
United States
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Joaquim Miguel Oliveira   Mail
3B’s Research Group, I3Bs, Research Institute on Biomaterials, Biodegradables and Biomimetics, University of Minho
Portugal
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Aleksandr Ovsianikov   Mail
Vienna University of Technology
Austria
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Ibrahim Tarik Ozbolat   Mail
Penn State University
United States
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Michael Raghunath   Mail
Zurich University of Applied Sciences
Switzerland
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Jin-Hyung Shim   Mail
Korea Polytechnic University
Korea, Republic of
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Cijun Shuai   Mail
Central South University
China
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Paulo Jorge Da Silva Bartolo   Mail
Nanyang Technological University, Singapore
Singapore
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Ergün Süleyman   Mail
University Würzburg
Germany
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Lay Poh Tan   Mail
Nanyang Technological University
Singapore
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Savas Tasoglu   Mail
Koc University, Turkey
Turkey
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Sanjairaj Vijayavenkataraman   Mail
New York University Abu Dhabi
United Arab Emirates
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Xiaohong Wang   Mail
Center of 3D Printing & Organ Manufacturing, School of Intelligent Medicine, China Medical University
China
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Shoufeng Yang   Mail
University of Southampton, UK
United Kingdom
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Yi Zhang   Mail
School of Electronics Science and Engineering University of Electronic Science and Technology of China
China
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Yu Shrike Zhang   Mail
Department of Medicine, Harvard Medical School
United States
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Prof. Veronica MacChi   Mail
Institute of Human Anatomy, Dep Neurosciences, University of Padova
Italy
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Prof. Shinji Sakai   Mail
Graduate School of Engineering Science,Osaka University
Japan
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Prof. Giovanni Vozzi   Mail
Research Center  "E. Piaggio", University of Pisa
Italy
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Prof. Swee Leong Sing   Mail
Department of Mechanical Engineering, National University of Singapore
Singapore
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Kedong Song   Mail
Dalian University of Technology
China